Industrial talks


ANSYS - RF Power Amplifier design Using Nested Multi-Technology

Speaker : Remy Fernandes

Abstract : RF power amplifiers (PA) are a part of every wireless system. Wireless systems are achieving higher data rates by adopting more complicated modulation schemes; this requirement demands that the PA be designed with improved linear power and efficiency.On top of these additional design challenges, regulations are imposing tough specifications for Electromagnetic Interference (EMI).
To achieve these design challenges and reduce time to market, accurate simulation methodologies must be employed in the PA design process. Power amplifiers are composed of high-power RF transistors that integrate different material technologies into a single device that are mounted on a test fixture comprised of various materials.

Running circuit simulation with analytical models, including high power RF transistors, is no longer sufficient. Interaction between the different material technologies needs to be simulated to accurately predict the power amplifier performance. Utilizing the nested multi-technology capabilities of ANSYS software tools to enhance the power amplifier design process will be discussed in this presentation. In addition to the electro-magnetic simulations of the nested multi-technology for the power amplifier design, integration of thermal and mechanical simulations will be explored
.

National instruments - Module Design: The case for EDA integration

Speaker : Edwards Malcolm

Abstract : Communication and military systems are shrinking in size with greater use of the multiple technology modules replacing conventional board and hybrid designs.  The use of mixed technologies (GaAs, GaN, Silicon, HDI laminates, SAW and BAW devices) still dominate the preferred solutions for RF/Microwave and MM devices. This technology mix provides highly competitive power handling, robustness and frequency selection.  This presentation will focus on the EDA tool set needed to support these complex designs
 

Amcad Engineering - Behavioral modeling tools are now mature enough to bridge the gap between measurement and simulation work

 Speaker : Tony Gasseling

Abstract : AMCAD Engineering uses specific and patented methodologies for the characterization and the modeling of RF and MW circuits. These methods make it possible to collect more information on the device under tests.

These additional information make it possible to develop more realistic models of components or circuits for computer-aided design works. By combining the realism of the models obtained and the use of high-performance simulations, AMCAD lays the foundation for a better design of electronic circuits and telecommunication systems.

The turnkey software and hardware solutions offered by AMCAD Engineering reduce the time-to-market of these high frequency electronic products.

Finally, the use of more accurate predictive models allows the design to be more efficient in term of power consumption, enabling the reduction of the operational costs of your electronic systems.